Offered in both silicon and silicon carbide versions, Microchip’s SP1F and SP3F power modules now come with press-fit terminals for high-volume applications. Press-fit terminals enable solder-free PCB ...
Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).
In 2004, Intel specified a standard integrated Driver-MOSFET (DrMOS) device for use in a typical PC platform. This specification’s goal was to provide features for an integrated device to produce the ...
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