Semiconductor makers STMicroelectronics and Infineon have teamed with 3D packaging provider STATS ChipPAC to jointly develop the next generation of embedded Wafer-Level Ball Grid Array (eWLB) ...
MUNICH, Germany — Infineon has granted licenses for its eWLB chip packaging technology to competitor STMicroelectroncis as well as to Singapore-based packaging engineering company STATS ChipPAC. The ...
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